Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C

Description

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Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F - -
Gallery.
Product Description
Features
No Clean
Lead Free / RoHS
Solder Paste
Low Temprature
Syringe
Description
Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F eutectic. Metal Content: 87% metal by weight. Particle Size: T3 (25-45 microns) Size: 5cc/15g syringe
Technical Details
Brand:
Category:
Solder
Color:
Manufacturer Part Number (MPN):
Model:
SMDLTLFP-CHIP QUIK
Manufacturer:
Package Dimension: 0.3 x 4 x 2.8 inchs., Weight: 0.07lbs.
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